1. 2. 3. material content data sheet sales product name bsc0901nsi issued 14. august 2015 ma# ma001025842 package pg-tdson-8-6 weight* 118.48 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.629 0.53 0.53 5310 5310 leadframe non noble metal iron 7439-89-6 0.038 0.03 319 inorganic material phosphorus 7723-14-0 0.011 0.01 96 non noble metal copper 7440-50-8 37.762 31.87 31.91 318720 319135 wire noble metal gold 7440-57-5 0.045 0.04 0.04 380 380 encapsulation organic material carbon black 1333-86-4 0.088 0.07 739 plastics epoxy resin - 6.215 5.25 52455 inorganic material silicondioxide 60676-86-0 37.464 31.62 36.94 316209 369403 leadfinish non noble metal tin 7440-31-5 1.470 1.24 1.24 12406 12406 plating noble metal silver 7440-22-4 0.166 0.14 0.14 1397 1397 solder noble metal silver 7440-22-4 0.023 0.02 198 non noble metal tin 7440-31-5 0.019 0.02 158 non noble metal lead 7439-92-1 0.895 0.76 0.80 7550 7906 heatspreader non noble metal iron 7439-89-6 0.011 0.01 96 inorganic material phosphorus 7723-14-0 0.003 0.00 29 non noble metal copper 7440-50-8 11.320 9.55 9.56 95545 95670 heat sink clip non noble metal iron 7439-89-6 0.022 0.02 188 inorganic material phosphorus 7723-14-0 0.007 0.01 57 non noble metal copper 7440-50-8 22.292 18.81 18.84 188148 188393 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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